Plasma Case Studies At AT&T's Merrimack Valley Works, oxygen plasma has been successfully substituted for CFC-113 in cleaning pre-encapsulated hybrid integrated circuits (HIC). Brunner reports that the method is safe, reliable, clean, and inexpensive when compared to CFC-113 or isopropanol (IPA). There are no waste disposal costs associated with the use of oxygen plasma. "OXYGEN-PLASMA CLEANING OF HYBRID INTEGRATED CIRCUITS," Robert J. Brunner, AT&T Technical Journal, March/April 1992, pp. 52-58. State Information | Glossary | Conversion Checklist | Comments Home | Process Advisor | Alternatives | Links | Search All SAGE material, Copyright© 1992, Research Triangle Institute Last Update: 29 December 1998 sage@rti.org http://clean.rti.org/alt_cs.cfm?id=pl&cat=cs