Printed Wiring Board Industry and Use Cluster Profile
ACKNOWLEDGMENTS
This report was prepared by Microelectronics and Computer Technology Corporation and The Institute
for Interconnecting and Packaging Electronic Circuits as part of a multi-stakeholder,
collaborative, Design for the Environment project. The EPA Project Officers were Kathy Hart
and Debbie Boger of the Design for the Environment Staff of the Office of Pollution Prevention and
Toxics. The report was constructed by Christopher Rhodes of the IPC and Greg Pitts of MCC,
with valuable assistance in the preparation and review provided by: George Cushnie and Mark Eelman
of CAI, Inc.; Steve Bold of Continental Circuits; Gary Roper of HR Industries;
and Fritz Fehrer and Ted Smith of the Silicon Valley Toxics Coalition. Acknowledgment is also given
to the members of the project Core Group, not mentioned above, who provided guidance and
feedback throughout the preparation of the report, including: Michael Kerr of Circuit
Center; John Lott of E.I. DuPont de Nemours; and Lori Kincaid of the University of
Tennessee. Thanks also to Star Summerfield of the IPC and Jana Hellier of MCC for incorporating
comments, editing, and formatting the report.