CASE STUDY # 163
1. Headline: Water Reduction and Wastewater Treatment in an
Electroplating Plant of Printed Circuit Boards
2. Background: See Below
3. Cleaner Production Principle: process modification
4. Description of Cleaner Production Application:
Technology Principle: This technology involves using
electrolysis and ion exchange to remove copper, spray
rinsing to reduce water usage, and treatment of
wastewater by neutralization and ultrafiltration.
Process and Waste Information: The process consists of
four lines, two of which contain an acidic copper bath, a
lead/tin bath, and spray or cascade rinse baths. The
third line is a stain bath with NH4OH and the rinse water
is returned to the bath. The fourth line is a mechanical
brush line, releasing heavy metal particles. Before 1980,
wastewater was sewered without treatment. It contained
5-8 mg/l of heavy metals, totally 160 kg/yr. Concentrates
were disposed as chemical waste by specialized companies.
In the new process, water reduction is achieved by
changing the rinse baths to cascade rinse baths, using
water from the cascade rinses for spray rinsing. The
spray water is transported to a wastewater treatment
installation.
The treatment begins by electrolytically recovering
copper. Copper particles from a mechanical brush line are
first dissolved by acids. Concentrations are decreased
from 300-400 ppm to approximately 10 ppm. A further
decrease in copper concentration is achieved by an ion
exchanger, reducing the copper content to less than 1 ppm.
Water containing heavy metals (only copper) in low
concentrations undergoes neutralization and
ultrafiltration. The sludge and concentrates are chemical
waste and disposed of by specialized companies. Water not
containing heavy metals is released without treatment.
Water use decreased by 15,000 m3/yr and 100-200 kg/yr of
sludge is produced. No new feedstocks were introduced and
no effects on product quality were reported.
Scale of Operation: The facility produces 100 m2/day of
printed circuitry and employees 5 people in the
electroplating department.
Stage of Development: The technology is fully
implemented.
Level of Commercialization: All equipment is widely
available.
Material/Energy Balances and Substitutions:
Material Category Quantity Before
Quantity After Waste Generation
(kg/yr):
Copper 160
1
Heavy metals unknown
negligible
Sludge 0 100-200
Feedstock Use: N/A N/A
Water Use (m3/yr): 25,000 10,000
Energy Use: N/A negligible
5. Economics
Investment Costs: Investment costs were Dfl 350,000 for
1980. Capital costs were 35,000 Dfl/yr.
Operational & Maintenance Costs: Costs were 9,000 Dfl/yr
for chemicals and 3,000 Dfl/yr for manpower.
Payback Time: The investment will not be paid back since
annual costs (Dfl 47,000) outweigh savings (Dfl 6,000 on
copper).
6. Advantages: Demands by water regulation authorities
prompted use of the measures. The facility now meets the
regulatory standards. Water usage has decreased by 15,000
m3/yr and copper levels in the wastewater have decreased
from 160 kg/yr to 1 kg/yr. Savings on copper were Dfl
6,000.
7. Constraints: It took 7-8 months (1.5 man-years) to
properly regulate the ultrafiltration system. No other
problems were encountered.
8. Contacts
Citation: Wastewater problems in the metal industry:
results of interviews in 48 companies). Dr. Ir W.H.
Rulkens, TNO, Maatschappelijke Technologie, postbus 342,
7300 AH Apeldoorn, Netherlands. TEL:(055)773344.
Industry/Program Contact and Address:
H.W. du Mortier
VOM
Jan van Eycklaan 2
Postbus 120
3720 AC Bilthoven
Netherlands
TEL: 31-30-287111
FAX: 31-30-287674
9. Keywords: the Netherlands, printed circuit board,
electroplating, ISIC 2113, electrolysis, ion exchange,
copper, ultrafiltration, heavy metal, rinsing, sludge.
10. Reviewer's Comments: This case study was originally
compiled by the UNEP IE Working Group on Metal Finishing.
It underwent a UNEP IE funded technical review in 1994 for
quality and completeness. It was edited for the ICPIC
diskette in July 1995.
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