Case
Study
ELECTRONICS MANUFACTURING
Switch to an Environmentally Safer Alkaline Etchant
| Company | NTI, Colorado Division 6035 Galley Road Colorado Springs, CO 80915 |
|---|---|
| Person to Contact | Frank Gorman, Tech. Director Telephone: (719) 574-4905 |
| Product or Service | Circuit Boards |
| Number of Employees | 306 |
| Waste Stream Targeted | Etchants |
| Original System | Alkaline Ammonium Chloride Copper Etchant. Ammoniacal etchants are chelated and generate a chelated rinse water which can be minimized by rinsing the panels with fresh non-copper bearing replenishment etchant prior to the rinsing process. The original concentration of the spent alkaline etchant was 19 oz./gallon of copper. Most high- speed alkaline etchant proprietary formulations also contain Thiourea, a potentially hazardous additive in etchants to improve etching characteristics. Thiourea is listed as a hazardous substance and potential human carcinogen. Spent etchant is shipped off-site for reclamation and recycling. |
| New System (with P2 Modifications) |
Phibro-Guard TFT (Thiourea-Free Technology). Phibro- Guard TFT is also an ammoniacal alkaline etchant but is free of Thiourea. Phibro-guard TFT does not contain any carcinogens or suspected carcinogenic substances. In addition, the Phibro-Tech recycling process removes trace metallic impurities such as lead, zinc, chromium, and iron that may be a health hazard or detrimental to quality. The recycling process of spent etchant is copper reclamation and metal recovery done by Phibro-Tech using a proprietary method. |
| Cost Savings | Phibro-Guard TFT costs the same as most alkaline etchants. Other cost savings have not been quantified. Reclamation costs are the same. However, by optimizing the copper concentration within the spent etchant (19 oz./gallon to 20 oz./gallon) a 5% reduction in spent etch volume is generated or a $6,700/year savings. |
| Major Benefits | Cost savings of $6700/yr. Environmentally safer than existing high speed formulations while having performance characteristics equal or superior to commercially available products. Higher speed and copper yield are expected to be obtained. Combines high etching rates, superior line definition, low undercutting, banking, and speed additives. Compatible with metallic and aqueous dry film resists. Reduced worker health and safety, liability concerns. |
| Obstacles | Designed for use in conventional spray etching equipment using thermostatic temperature control and proper ventilation (protect working environment from ammonia and excessive ammonia loss). |
| Time Since Implementation | 1 month (12/5/95) |
| Source/Supplier | Phibro-Tech, Inc. 204 Sunset Drive Wilmette, IL 60091-3027 Rep: Martin Lieberman, (815) 727-1074 |
| Main Reason Implemented | Improve worker health and safety and improve quality. |
| Key to Success in Making this P2 Modification | Management commitment/support. Sharing of data and information with production operators to establish responsibility and ownership in P2. |
Created by Lighthouse Communications Group, LLC.
Edited for use on this site by Ronald Lee Still and posted with
permission of CDPHE.